ABF Process applicationDesmear ABF
◆ Desmear ABF series is a advance desmear process for high-end IC substrate with Semi-Additive Proecss(SAP)
◆ Excellent micro roughness on ABF materials for Supreme good adhesion with the electorless copper and plating copper.
Electroless Copper ABF
◆ Special design for high-end IC substrates under SAP and MSAP application
? High throwing power
? Excellent coverage and adhesion on ABF material
? Low internal stress deposition
? Environmentally friendly composition, EDTA free,cyanide free
? High peel strength under low Ra material
? High Purity copper depositionwith low resistivity, good for via filling performance.
? After Desmear Prodess (GL-102)
? After Electroless Cu Process (GL-102)